Submitted by Maria.Kapsalaki on Mon, 06/23/2014 - 15:38
This paper describes the latest developments in the simulation of a thermal probe apparatus, building on earlier work as reported by de Wilde et al. (2007). The work focuses on researching the role of the probe to sample conductance H. Results obtained with the existing model are proven to be inconclusive, and necessitate the change to flexible general engineering finite element software.
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