Submitted by Maria.Kapsalaki on Mon, 06/23/2014 - 15:38
This paper describes the latest developments in the simulation of a thermal probe apparatus, building on earlier work as reported by de Wilde et al. (2007). The work focuses on researching the role of the probe to sample conductance H. Results obtained with the existing model are proven to be inconclusive, and necessitate the change to flexible general engineering finite element software.
Submitted by Maria.Kapsalaki on Wed, 06/18/2014 - 14:44
The use of a thermal probe allows a range of in-situ conditions to be taken into account that impact upon the properties of building materials (λ, α) as encountered in reality. In this study, the transient thermal simulation of a model representing a line source in an infinite material sample has been used to guide the development of an experimental thermal probe apparatus. Simulation produced a series of datasets that have been used to test the data analysis routines used with the experimental probe.