LoginWe describe the potential of using hygroscopic materials that release moisture and latent heat in order to reduce the temperature of building envelopes and, there upon, conduction cooling loads. It is analysed 3 different weathers and a classic Brazilian wall with different values of paint permeance on both external and internal surfaces. The results are presented in terms of temperature, moisture content profiles and heat fluxes, showing how to save energy from the natural movement of moisture.
The potential of passive latent cooling in Brazil: a strategy to reduce conduction cooling loads in Brazil
Year:
2000
Bibliographic info:
Architecture, City, Environment: Proceedings of PLEA 2000, James & James (Science Publishers) Ltd, London, UK, 2000, ISBN 1 902916 16 6, proceedings of the Passive and Low Energy Architecture conference, held Cambridge, UK, July 2000, pp 417-418.