Thermosyphon in buildings: a solution for thermal bridging

Thermal bridging is a problem that arises from using a thermosyphon. It is used as a passive part of the building envelope in south facing walls. A solution is proposed and investigated in this paper. SolidWorks 2011 is used to simulate the thermal performance of the thermosyphon. A finite element analysis, FEA, (4 points Jacobian) is employed to measure the temperature and heat flux at different surfaces of the thermosyphon. Simulation results showed that the backward maximum heat flux reduces 76 times when a Teflon piece is introduced. As a result, this new design provides less heat loss due to thermal bridging.